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High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias

    Buy cheap High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias from wholesalers
     
    Buy cheap High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias from wholesalers
    • Buy cheap High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias from wholesalers
    • Buy cheap High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias from wholesalers
    • Buy cheap High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias from wholesalers

    High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias

    Ask Lasest Price
    Brand Name : YDY
    Model Number : HDI1
    Certification : ISO13485, IATF16949, ISO9001,IOS14001
    Price : $0.1 -$0.3/ 1 piece
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 30000pcs/month
    Delivery Time : 1-20 working days
    • Product Details
    • Company Profile

    High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias

    HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias


    HDI PCB Board Capabilities include:


    Laser Drilled Microvias
    Sequential Lamination
    Stacked Microvias
    Blind & Buried Vias
    Via-in-Pad
    Laser Direct Imaging
    .00275" Trace/Space
    Fine Pitch (Down to .3mm)



    PCB Manufacture Capacity

    FeatureCapability
    Service Type

    HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias

    Quality GradeStandard IPC 2
    Number of Layers4 - 48ayers
    Order Quantity1pc - 10000+pcs
    Build Time2days - 5weeks
    MaterialFR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
    Board SizeMin 6*6mm | Max 457*610mm
    Board Thickness0.4mm - 3.0mm
    Copper Weight (Finished)0.5oz - 2.0oz
    Min Tracing/Spacing2.5mil/2.5mil
    Solder Mask SidesAs per the file
    Solder Mask ColorGreen, White, Blue, Black, Red, Yellow
    Silkscreen SidesAs per the file
    Surface FinishHASL - Hot Air Solder Leveling
    Lead Free HASL - RoHS
    ENIG - Electroless Nickle/Immersion Gold - RoHS
    Immersion Silver - RoHS
    Immersion Tin - RoHS
    OSP - Organic Solderability Preservatives - RoHS
    Min Annular Ring4mil, 3mil - laser drill
    Min Drilling Hole Diameter6mil, 4mil - laser drill
    Max Exponents of Blind/Buried Viasstacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
    Other TechniquesFlex-rigid combination
    Via In Pad
    Buried Capacitor (only for Prototype PCB total area ≤1m²)

    High Quality HDI PCB Manufacturing


    HDI PCB designs push the limits of technology and Advanced Circuits is at the forefront of innovation, satisfying the most rigorous requirements.
    The demand for HDI PCB manufacturing has been increasing due to the advancements in technology and the many benefits HDI PCBs provide for high-tech applications. Fitting more technology in less space with fewer layers creates limitations for many PCB manufacturers that do not have the specialized equipment and the capacity for advanced features, finer lines, and tighter tolerances. HDI printed circuit board designs utilize a combination of advanced features like microvias, blind vias, via-in-pad, along with stacked and staggered vias to maximize the the space of the board while increasing its performance and functionality.


    ]High quality and precision with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.


    High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias


    Shenzhen Yideyi Technology Co., Ltd can provide one-stop service, from the PCB production, the components purchasing to thecomponents assembled.​


    High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias



    FAQs:

    1, Do you offer quick turn PCB Assembly ?
    Yes, we offer 24 hours quick turn PCB Assembled Solution without sacrifice the quality of the PCB Board.

    2, Do you offer X-Ray capability ?
    Yes, we inspect the boards using X-ray and therefore offer total reliability.

    3, Do you offer conformal coating service ?
    Yes, conformal coating is a part of our value-added services.

    4, Do you offer testing service ?
    Yes, we offer robust functional testing that adds to the product reliability.

    5, Do you offer IPC 610 or J-STD Quality inspections ?
    Absolutely, we offer these inspections as per client requirements.

    6, Do you offer first article inspection ?
    Yes, basis client requirements, we are well equipped to offer first article inspection.

    7, What is your standard turnatound time for PCB Assembly ?
    Our standard turnaround time for PCB Assembly is 3 weeks.

    Quality High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias for sale
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